Coupling a light sensor array with an optical component

ABSTRACT

An optical component system includes an optical component having a plurality of ports through which light signals exit the optical component. The system also includes a light sensor array having a plurality of light sensors. The light sensor array is coupled to the optical component such that different light sensors receive light signals that exit the optical component through different ports. The system also includes a light barrier positioned between the optical component and the light sensor array and between adjacent light sensors. In some instances, the light barrier is one of a plurality of light barriers that are each positioned between adjacent light sensors.

RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.10/267,812, filed on Oct. 8, 2002 now U.S. Pat. No. 7,308,166, entitled“Coupling a Light Sensor Array with an Optical Component” andincorporated herein in its entirety.

This application is related to U.S. patent application Ser. No.10/161,208, filed on May 31, 2002, entitled “Waveguide Tap Monitor” andincorporated herein in its entirety.

BACKGROUND

1. Field of the Invention

The invention relates to systems having light sensors coupled with anoptical component. In particular, the invention relates to coupling alight sensor array to an optical component.

2. Background of the Invention

A variety of optical component systems include an optical componentcoupled with one or more light sensors. The optical components includeone or more waveguides where light signals are constrained. Thesewaveguides often terminate at a port through which light signals exitthe optical component. The light sensor array is often coupled with theoptical component so each light sensor receives light from one or moreports. As a result, each light sensor is generally associated with oneor more ports on the optical component. Light can travel in the regionbetween the light sensor array and the optical component. As a result,light from a particular port can enter this region and travel to anunassociated light sensor. Light that travels to an unassociated port isa source of cross talk. Because cross talk adversely affects theperformance of the system, there is a need for a system having reducedcross talk.

SUMMARY OF THE INVENTION

The invention relates to an optical component system. The systemincludes an optical component having a plurality of ports through whichlight signals exit. The system also includes a light sensor array havinga plurality of light sensors. The light sensor array is coupled to theoptical component such that different light sensors receive lightsignals that exit the optical component through different ports. Thesystem also includes a light barrier positioned between the opticalcomponent and the light sensor array and between adjacent light sensors.In some instances, the light barrier is one of a plurality of lightbarriers that are each positioned between adjacent light sensors.

In another embodiment of the system, the light barrier is positionedbetween the optical component and the light sensor array over a regionof the optical component between adjacent ports.

In some instances, the light barrier is positioned in contact with acontact pad positioned on the optical component and a contact padpositioned on the light sensor array. The light barrier can electricallyconductive. For instance, the light barrier can include a metal.

In some instances, a bonding medium is positioned adjacent to the lightbarrier. The bonding medium can serve to bond the optical component withthe light sensor array. In some instances, the bonding medium is incontact with a contact pad positioned on the optical component and acontact pad positioned on the light sensor array. The bonding medium canelectrically conductive.

In some instances, the ports are configured to direct the light signalssuch that the light signals exiting the optical component travel towarda location positioned over the optical component. The port can include arecess formed in the optical component. A solid light transmittingmedium can be formed between the light signal array and bottom of therecess.

The invention also relates to a method of forming an optical componentsystem. The method includes obtaining an optical component having aplurality of ports through which light signals exit the opticalcomponent. The method also includes obtaining a light sensor arrayincluding a plurality of light sensors. The array is coupled to theoptical component such that different light sensors receive lightsignals that exit the optical component through different ports. Themethod further includes bonding the light sensor array and the opticalcomponent such that a light barrier is positioned between the opticalcomponent and the light sensor array and between adjacent light sensors.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1A is a topview of an optical component that is suitable for usewith a light sensor array.

FIG. 1B is a cross section of the optical component taken at the linelabeled B in FIG. 1A.

FIG. 1C is a cross section of the optical component taken at the linelabeled C in FIG. 1A.

FIG. 1D is a cross section of the optical component taken at the linelabeled D in FIG. 1A.

FIG. 1E is a particular example of an optical component constructed on asilicon-on-insulator wafer.

FIG. 2A is a bottom view of a light sensor array including a pluralityof light sensors.

FIG. 2B is a topview of an optical component system including the lightsensor array of FIG. 2B coupled with an optical component. A lightbarrier is positioned adjacent to a region of the light sensor arraybetween adjacent light sensors.

FIG. 2C is a cross section of the optical component system taken alongthe line labeled C in FIG. 2B.

FIG. 2D is a cross section of the optical component system taken alongthe line labeled D in FIG. 2B.

FIG. 2E is a topview of the optical component system shown in FIG. 2Bwithout the light sensor array illustrated in FIG. 2B.

FIG. 3A is a cross section of an optical component system having a lightsensor array coupled with an optical component. A light barrier and abonding medium are positioned adjacent to a region of the light sensorarray between adjacent light sensors.

FIG. 3B is a topview of the optical component system shown in FIG. 3Awithout the light sensor array in place.

FIG. 3C is a topview of an optical component system without the lightsensor array in place. Light barriers are positioned adjacent to aregion of the light sensor array between adjacent light sensors. Abonding medium is positioned adjacent to the light barrier and surroundsa plurality of the sensors.

FIG. 4A is a cross section of an optical component system having a lightsensor array coupled with an optical component.

FIG. 4B is a topview of the optical component system shown in FIG. 4Awithout the light sensor array. A bonding medium surrounds a pluralityof ports and light sensors. A gap formed between the bonding mediumassociated with adjacent light sensors serves to keep the adjacentsensors electrically isolated.

FIG. 5A is a cross section of an optical component system having a lightsensor array coupled with an optical component.

FIG. 5B is a topview of the optical component system without the lightsensor array. A light barrier surrounds a plurality of ports and lightsensors. A gap formed between light barriers associated with adjacentlight sensors serves to keep the adjacent sensors electrically isolated.

FIG. 6A through FIG. 6I illustrate a method of coupling an opticalcomponent with a light sensor array

DETAILED DESCRIPTION

The invention relates to an optical component system. The systemincludes an optical component having a plurality of ports through whichlight signals exit the optical component. The system also includes alight sensor array having a plurality of light sensors. The light sensorarray is coupled to the optical component such that different lightsensors receive light signals from different ports. As a result, eachport is associated with a particular light sensor. The system alsoincludes light barriers between the optical component and the lightsensor array. The light barriers are positioned between adjacent lightsensors. As a result, the light barriers can prevent a light signalexiting a particular port from traveling to an unassociated lightsensor.

In some instances, the light barrier is positioned between an electricalcontact pad on the optical component and an electrical contact pad onthe light sensor array. The light barrier can be constructed of anelectrically conducting material. As a result, the light barrier canalso serve to provide electrical communication between the opticalcomponent and the light sensor array.

FIG. 1A through FIG. 1D illustrate an optical component 10 that issuitable for use with a light sensor array 50. FIG. 1A is a topview ofthe optical component 10. FIG. 1B is a cross section of the opticalcomponent 10 taken at the line labeled B and FIG. 1C is a cross sectionof the optical component 10 taken at the line labeled C. FIG. 1D is across section of the optical component 10 taken at the line labeled D.

The optical component 10 includes waveguides 12 defined in a first lighttransmitting medium 14 positioned on a base 16. The first lighttransmitting medium 14 includes a ridge 18 that defines an upper portionof the waveguides 12. Suitable light transmitting media include, but arenot limited to, silicon, polymers, silica, SIN, GaAs, InP and LiNbO₃.The portion of the base 16 adjacent to the first light transmittingmedium 14 reflects light signals from the waveguides 12 back into thewaveguides 12. As a result, the base 16 defines a lower portion of thewaveguides 12. The line labeled E in FIG. 1B illustrates the modeprofile of a light signal carried in a waveguide 12.

The optical component 10 includes a plurality of ports 20 through whichlight signal exit the optical component 10. Each port 20 includes arecess having one or more sides. The illustrated embodiment includes abottom side 26 and a plurality of lateral sides including a leading side28 and a following side 30.

FIG. 1C illustrates operation of a port 20. A light signal travelingalong a waveguide 12 is transmitted through the leading side 28 of theport 20 as illustrated by the arrow labeled E. The port 20 isconstructed so one or more sides receive the light signal. In someinstances, the port 20 is constructed to refract the tapped portiontoward one or more of the sides. The following side 30 is illustrated asreceiving the light signal. One or more of the sides receiving the lightsignal are constructed to reflect the lights signal such that the lightsignal travels away from the optical component 10. Accordingly, the port20 redirects the light signal such that the light signal travels awayfrom the base 16. Further, when a plane is defined by the direction ofpropagation of the light signal along the waveguides 12, the port 20redirects the tapped portion of the light signal such that that thetapped portion of the light signal travels out of the plane. Additionaldetails regarding the construction of the port 20 are provided in U.S.patent application Ser. No. 10/161,208, filed on May 31, 2002 andentitled “Waveguide 12 Tap Monitor.”

FIG. 1C shows a reflecting layer 32 positioned on portions of the firstlight transmitting medium 14. The reflecting layer 32 is selected toreflect incident light. The reflecting layer 32 is formed on bottom ofthe recess and on the following side 30 but is not formed on the leadingside 28. As a result, the reflecting layer 32 permits the light signalto be transmitted through the leading side 28 while being reflected offthe bottom of the recess and the following side 30. A suitablereflecting layer 32 includes, but is not limited to, metals such asaluminum. Although the reflecting layer 32 is illustrated in FIG. 1Athrough FIG. 1D, the reflecting layer 32 is optional in many instances.

The optical component 10 includes a plurality of electrical contactpads. A first component pad 34 is positioned adjacent to each port 20.Conductors 36 provide electrical communication between each firstcomponent pad 34 and a second component pad 38. Conductors 36 alsoprovide electrical communication between a first common component pad 40and a second common component pad 42.

FIG. 1E is a cross section of an optical component 10 and shows aparticular optical component 10 construction. The illustrated opticalcomponent 10 is constructed on a silicon-on-insulator wafer. Asilicon-on-insulator wafer typically includes a silica layer 44,positioned between a silicon layer 46 and a silicon substrate 48. Thesilicon layer 46 serves as the first light transmitting medium 14. Thesilica layer 44 and the silicon substrate 48 serve as the base 16. Thesilica layer 44 serves as a light barrier 58 that reflects light signalsfrom the first light transmitting medium 14 back into the first lighttransmitting medium 14. An aluminum reflecting layer 32 is positioned onat least the bottom side 26 and on the following side 30. The port 20can be etched into the silicon layer 46. The crystalline structure ofthe silicon layer 46 causes the leading side 28 and the following side30 to be naturally formed at an angle of about 54.7° measured relativeto the silica layer 44.

FIG. 2A through FIG. 2E illustrate an optical component system 49 havinga light sensor array 50 coupled with an optical component 10. FIG. 2A isa bottom view of a light sensor array 50. FIG. 2B is a topview of theoptical component system 49 including the light sensor array 50 of FIG.2B coupled with an optical component 10. FIG. 2C is a cross section ofthe optical component system 49 shown in FIG. 2B taken along the linelabeled C. FIG. 2D is a cross section of the optical component system 49shown in FIG. 2B taken along the line labeled D. FIG. 2E is a topview ofthe optical component system 49 shown in FIG. 2B with the light sensorarray 50 removed from FIG. 2B.

The light sensor array 50 includes a plurality of light sensors 52. Asuitable light sensor 52 outputs an electrical signal in response toreceiving a light signal. Examples of a suitable light sensor 52include, but are not limited to, a photodetectors, photodiodes,avalanche photodiodes, charge coupled devices (CCDs), andphotomultiplier tubes. The light sensor array 50 includes a plurality ofelectrical contact pads. Each light sensor 52 is in electricalcommunication with a first array pad 54 positioned adjacent to the lightsensor 52. Each light sensor 52 is also in electrical communication witha common array pad 56 positioned on the top side of the light sensorarray 50. Suitable light sensor arrays are available from suppliers suchas OSI Fibercomm, Inc., Ferminoics and Sensors Unlimited.

The light sensor array 50 is coupled with the optical component 10 soeach light sensor 52 is positioned to receive the light signals thatexit from a particular port 20 of the optical component 10. Accordingly,each light sensor 52 is associated with a particular port 20 on theoptical component 10.

Light barriers 58 are positioned between the optical component 10 andthe light sensor array 50. At least one light barrier 58 is positionedadjacent to a region of the optical component 10 between ports 20.Additionally, one or more of the light barriers 58 are positionedadjacent to a region of the optical component 10 between light sensors52. Suitable light barriers 58 are selected to absorb and/or reflect anincident light signal. As a result, the position of the light barriers58 serves to reduce cross talk. For instance, the light barriers 58 canprevent a light signal from the port 20 labeled A from entering thelight sensor 52 labeled B as shown by the arrow labeled B in FIG. 2D.Suitable light barriers 58 include, but are not limited to, opaquematerials such as metals, plastics, solder, carbon and ceramics. In someinstances, a low transmission material can serve as the light barrier58. For instance, materials transmitting less than 10% of 1550 nm light,less than 5% of 1550 nm light, 1% of 1550 nm light, 0.5% of 1550 nmlight or 0.0% of 1550 nm light can serves as a suitable light barrier58. Epoxies are an example of materials that can have different lighttransmission characteristics.

As shown in FIG. 2D, a light barrier 58 can be positioned in contactwith a first component pad 34 and a first array pad 54. The lightbarrier 58 can be constructed of an electrically conducting materialthat provides electrical communication between the first array pad 54and the first component pad 34. Because each first array pad 54 is inelectrical communication with a light sensor 52 and because each firstcomponent pad 34 is in electrical communication with a second componentpad 38, the light barrier 58 can serve to complete the electricalcommunication between each light sensor 52 and a second component pad38. A suitable light barrier 58 for providing electrical communicationbetween a first array pad 54 and a first component pad 34 includes, butis not limited to, a metal such as gold.

A conductor 36 provides electrical communication between the commonarray pad 56 and the first common component pad 40. Because each lightsensor 52 is in electrical communication with the common array pad 56and because the first common component pad 40 is in electricalcommunication with a second common component pad 42, the conductor 36serves to complete the electrical communication between each lightsensor 52 and the second common component pad 42. A suitable conductor36 for providing electrical communication between the common array pad56 and the first common component pad 40 is a wire 60 that is wirebonded to the common array pad 56 and the first common component pad 40.

The second component pad 38 and the second common component pad 42 caneach be coupled with electronics (not shown) for monitoring the lightsensors 52. The electronics can monitor the output from a particularlight sensor 52 by monitoring a circuit that includes that light sensor52. Accordingly, the electronics can monitor the output from aparticular light sensor 52 by monitoring a circuit completed through thesecond component pad 38 in electrical communication with that lightsensor 52 and the second common pad.

A region between the light sensor array 50 and the optical component 10can be filled with a second light transmitting medium 62. The secondlight transmitting medium 62 has a different index of refraction thanthe first light transmitting medium 14. The change in the index ofrefraction can cause refraction of light signals transmitted through theleading side 28 of a port 20. As a result, the second light transmittingmedium 62 can be selected to have an index of refraction that provides arefraction angle. Suitable second light transmitting media includegasses such as air and solids such as epoxy and polymers.

A sealing medium 64 can be positioned over the light sensor array 50.Although the sealing medium need not be transparent, the sealing mediumis illustrated as transparent in FIG. 2B for the purposes ofillustration. In some instances, the sealing medium 64 encapsulates thelight sensor array 50 on the optical component 10. The sealing medium 64can be selected to provide a hermetic seal that reduces the influence ofdust and other atmospheric affects on the performance of the opticalcomponent system 49. Additionally, the sealing medium 64 can enhance thebonding strength of the light sensor array to the optical component.

In some instances, the light barrier 58 is selected to bond the lightsensor array 50 to the optical component 10. For instance, certainepoxies can serves as a light barrier 58 and can bond the light sensorarray 50 to the optical component 10. Alternatively, the light barrier58 can be employed in conjunction with a bonding medium 66 asillustrated in FIG. 3A and FIG. 3B. FIG. 3A is a cross section of anoptical component system 49 having a light sensor array 50 coupled withan optical component 10. FIG. 3B is a topview of the optical componentsystem 49 shown in FIG. 3A with the light sensor array 50 removed.

A bonding medium 66 is positioned adjacent to the light barrier 58. Thebonding medium 66 bonds the light sensor array 50 to the opticalcomponent 10 while the light barrier 58 serves to reduce the cross talk.The bonding medium 66 can also serve as a light barrier 58. Forinstance, the bonding medium 66 can transmit a low port 20 of the lightsignals. As a result, the bonding medium 66 and the light barrier 58 canat together to provide more of a light barrier 58 than is provided bythe light barrier 58 alone.

The light barrier 58 and the bonding medium 66 can both serve to provideelectrical communication between a first component pad 34 and a firstarray pad 54. For instance, the light barrier 58 can be a metal such asgold and the bonding medium 66 can be an electrically conducting epoxyor solder. Although not shown, a layer of the bonding medium 66 can formbetween the light barrier 58 and the optical component 10 and/or betweenthe light barrier 58 and the light sensor array 50. The use of anelectrically conducting bonding medium 66 prevents these layers fromdisrupting the current flow from the first component pad 34 to the firstarray pad 54. Further, an electrically conducting bonding medium 66 caneliminate the need for an electrically conducting light barrier 58because the boding medium can conduct current between the firstcomponent pad 34 and the first array pad 54.

In some instances, the bonding medium 66 is an electrical insulator andthe light barrier 58 serves to provide electrical communication betweena first component pad 34 and a first array pad 54. In these instances,the optical component system 49 can be arranged as illustrated in FIGS.3A and 3B. Alternatively, the optical component system 49 can bearranged as illustrated in FIG. 3C. FIG. 3C is a topview of an opticalcomponent system 49 with the light sensor array 50 removed. Lightbarriers 58 are positioned between adjacent ports 20 while the bondingmedium 66 surrounds a plurality of the ports 20. Because the bondingmedium 66 is an electrical insulator, the sensors remain electricallyisolated.

In some instances, the bonding medium 66 is an electrical insulator andthe light barrier 58 serves to provide electrical communication betweena first component pad 34 and a first array pad 54. In these instances,the optical component system 49 can be arranged as illustrated in FIGS.3A and 3B. Alternatively, the optical component system 49 can bearranged as illustrated in FIG. 3C. FIG. 3C is a topview of an opticalcomponent system 49 with the light sensor array 50 removed. Lightbarriers 58 are positioned between adjacent ports 20 while the bondingmedium 66 surrounds a plurality of the ports 20. Because the bondingmedium 66 is an electrical insulator, the sensors remain electricallyisolated.

The bonding medium 66 can also surround the ports 20 when the bondingmedium 66 is electrically conducting as shown in FIG. 4A and FIG. 4B.FIG. 4A is a cross section of an optical component system 49 having alight sensor array 50 coupled with an optical component 10. FIG. 4B is atopview of the optical component system 49 shown in FIG. 4A with thelight sensor array 50 removed. The bonding medium 66 surrounds aplurality of ports 20 and light sensors 52. A gap formed between thebonding medium 66 associated with adjacent light sensors 52 serves tokeep the adjacent sensors electrically isolated.

The light barrier 58 can surround the sensor as shown in FIG. 5A andFIG. 5B. FIG. 5A is a cross section of an optical component system 49having a light sensor array 50 coupled with an optical component 10.FIG. 5B is a topview of the optical component system 49 shown in FIG. 5Awith the light sensor array 50 removed. The light barrier 58 surrounds aplurality of ports 20 and light sensors 52. When the light barrier 58 iselectrically conducting, a gap formed between the light barrier 58associated with adjacent light sensors 52 serves to keep the adjacentsensors electrically isolated.

In some instances, electrical communication between electronics and thelight sensors 52 is achieved without a current passing through the lightbarrier 58 and/or through the bonding medium 66. For instance, the firstarray pads 54 can be positioned on the top of the light sensor array 50and wire bonding can be employed to bond wires 60 to the first arraypads 54. These wires 60 can be connected to the electronics or to firstcomponent pads 34 that are not positioned under the light sensor array50. As a result, neither the first array pads 54 nor the first componentpads 34 need be positioned between the optical component 10 and thelight sensor array 50. When electrical communication between electronicsand the light sensors 52 is achieved without a current passing throughthe light barrier 58 and/or through the bonding medium 66, neither thelight barrier 58 nor the bonding medium 66 need be electricallyconductive.

FIG. 6A through FIG. 6I illustrate a method of coupling an opticalcomponent 10 with a light sensor array 50. FIG. 6A and FIG. 6Billustrate a suitable optical component 10 for use with the opticalcomponent system 49. FIG. 6A is a topview of the optical component 10.FIG. 6B is a cross section of the optical component 10 taken along theline labeled A in FIG. 6A. A suitable method for constructing an opticalcomponent 10 having the illustrated waveguides 12 and ports 20 is taughtin U.S. patent application Ser. No. 10/161,208, filed on May 31, 2002and entitled “Waveguide 12 Tap Monitor.” The first component pads 34,the second component pads 38, the first common component pad 40, thesecond common component pad 42 and the conductors 36 can be formed onthe optical component 10 using integrated circuit fabricationtechnologies.

A light barrier 58 is positioned on a region of the optical component 10between adjacent ports 20. A suitable light barrier 58 includes, but isnot limited to, a metal. A metal such as gold can be formed on theoptical component 10 as a gold line or a gold ball. Gold lines can beformed on the optical component 10 employing a gold wedge bonder. Thelight barrier 58 can be positioned on the first component pads 34 whenthe light barrier 58 is to provide electrical communication between thelight sensor array 50 and the optical component 10.

The light barrier 58 can be compressed to provide the optical component10 shown in FIG. 6C and FIG. 6D. FIG. 6C is a topview of the opticalcomponent 10. FIG. 6D is a cross section of the optical component 10taken along the line labeled A in FIG. 6A. Compression of the lightbarrier 58 can flatten out the top and the bottom of the metal line andimprove the interface between the light barrier 58 and the opticalcomponent 10 or between the light barrier 58 and the light sensor array50. A suitable method for compressing the light barrier 58 includes, butis not limited to, using a flip-chip bonder.

The liquid form of a bonding medium 66 is formed on the light barriers58. Suitable boding media include, but are not limited to, electricallyconducting epoxies such as ABLEBOND from Ablestik, Inc. and H2O fromEpo-Tek, Inc. The liquid form of an epoxy can be deposited on the lightbarriers 58 employing an epoxy dispenser. The light barrier can preventthe liquid form of the bonding medium from running into the adjacentports.

A light sensor array 50 is bonded to the optical component 10 to providethe optical component system 49 illustrated in FIG. 6E and FIG. 6F. FIG.6E is a topview of the optical component system 49. FIG. 6F is a crosssection of the optical component system 49 taken along the line labeledA in FIG. 6E. The light sensor array 50 is positioned on the opticalcomponent 10 such that the reach light sensor 52 is positioned toreceive light signals from a particular port 20. When the bonding medium66 is an epoxy, the epoxy can be cured to immobilize the light sensorarray 50 relative to the optical component 10.

A second light transmitting medium 62 is formed between the light sensorarray 50 and the optical component 10 to provide the optical componentsystem 49 illustrated in FIG. 6G and FIG. 6H. FIG. 6G is a topview ofthe optical component system 49. FIG. 6H is a cross section of theoptical component system 49 taken along the line labeled A in FIG. 6G.The second light transmitting medium 62 can be formed by employing aliquid medium precursor. A suitable liquid medium precursor can beconverted into the second light transmitting medium 62. The liquidmedium precursor can be transported into the region between the lightsensor array 50 and the optical component 10. For instance, the liquidmedium precursor can be positioned adjacent to an opening between thelight sensor array 50 and the optical component 10 under conditions thatcause the liquid medium precursor to be wicked into the region betweenthe light sensor array 50 and the optical component 10. The liquidmedium precursor can then be converted to the second light transmittingmedium 62.

As noted above, a suitable liquid medium precursor can be converted fromthe liquid state into the second light transmitting medium 62. Theliquid medium precursor can be the liquid state of the epoxy before theepoxy is cured. The liquid state of the epoxy can cured to convert theliquid medium precursor to the second light transmitting medium 62. Asuitable liquid medium precursor for use with a silicon lighttransmitting medium includes, but is not limited to, OG146 from Epo-TEK,Inc., 310 EPOXY from Epo-TEK, Inc. or ADHESIVE 61 from Norland, Inc. Theoptical component system 49 can be preheated to a temperature sufficientto wick the liquid medium precursor into the region between the opticalcomponent 10 and the light sensor array 50. The temperature of theoptical component system 49 can be further elevated for a period of timesufficient to cure the liquid medium precursor.

A wire 60 is bonded to the common array pad 56 and the first commoncomponent pad 40 so as to provide electrical communication between thecommon array pad 56 and the first common component pad 40. Wire bondingcan be employed to bond the wire 60 to the common array pad 56 and thefirst common component pad 40.

A sealing medium 64 is formed on the light sensor array 50 to providethe optical component system 49 illustrated in FIG. 6I. FIG. 6I is atopview of the optical component system 49. Suitable sealing media 64include, but are not limited to, 832 ADHESIVE from MG Chemical, Inc.,832 ADHESIVE from MG Chemical, Inc., EP31 from Masterbond, Inc., TSE 397from General Electric, Inc.

Although the optical component system is disclosed in the context of alight sensor array positioned over the optical component, the aboveprinciples can be applied to a light sensor array coupled to a side ofan optical component. Accordingly, the ports can be waveguide facetspositioned at the edge of the optical component.

Although the optical component is disclosed in the context of opticalcomponents having ridge waveguides, the principles of the presentinvention can be applied to optical components having other waveguidetypes. Suitable waveguide types include, but are not limited to, buriedchannel waveguides and strip waveguide.

Other embodiments, combinations and modifications of this invention willoccur readily to those of ordinary skill in the art in view of theseteachings. Therefore, this invention is to be limited only by thefollowing claims, which include all such embodiments and modificationswhen viewed in conjunction with the above specification and accompanyingdrawings.

1. An optical system, comprising: an optical component having aplurality of waveguides that each has a length, the waveguides beingpositioned on a substrate such that each waveguide is immobilizedrelative to the substrate along the length of the waveguide, the opticalcomponent also having ports through which light signals guided throughthe waveguides exit the optical component; a light sensor arrayincluding a plurality of light sensors, different light sensorsconfigured to receive light signals from different waveguides, eachwaveguide is associated with the light sensor configured to receive thelight signals from that waveguide; and a light barrier positionedbetween the optical component and the light sensor array, the lightbarrier configured to prevent a first light signal traveling through thelight transmitting medium from being received at one or more of thelight sensors that are not associated with the waveguide from which thefirst light signal exited.
 2. The system of claim 1, wherein the lightbarrier is between an electrical contact pad on the optical componentand an electrical contact pad on the light sensor array.
 3. The systemof claim 1, wherein the light barrier includes a metal.
 4. The system ofclaim 1, wherein the light barrier is positioned so as to surround anoptical path that the first light signal travels from the waveguide fromwhich the first light signal exited to the associated light sensor. 5.The system of claim 1, wherein a bonding medium is positioned adjacentto the light barrier, the bonding medium bonding the optical componentto the light sensor array.
 6. The system of claim 5, wherein the bondingmedium is electrically conductive.
 7. The system of claim 1, wherein thelight sensor array is positioned over the optical component such thatthe ports are between the substrate and the light sensor array.
 8. Thesystem of claim 1, wherein the ports are configured to re-direct thelight signals from the waveguides to a region over the optical componentsuch that the waveguides are positioned between the substrate and theregion over the optical component.
 9. The system of claim 1, furthercomprising: a bonding medium bonding the optical component to the lightsensor array; and a medium encapsulating the light sensor array, themedium being different from the bonding medium.
 10. The system of claim1, wherein the light barrier is one of a plurality of light barriersbetween the optical component and the light sensor array, the lightbarriers being configured to prevent the light signals traveling throughthe light transmitting medium from being received at the light sensorsthat are not associated with the waveguide from which each light signalexited.
 11. The system of claim 1, wherein the light barrier extendsfrom a region of the optical component between ports to a region of thelight sensor array between light sensors.
 12. The system of claim 1,wherein the light barrier is electrically conducting and provideselectrical communication between an electrical contact pad on theoptical component and an electrical contact pad on the light sensorarray.
 13. The system of claim 12, wherein the electrical contact pad onthe optical component is between ports and the electrical contact pad onthe light sensor array is between light sensors.
 14. The system of claim1, wherein the waveguides are arranged such that lengths of thewaveguides define a plane and the ports are configured to re-direct thelight signals traveling along the waveguides out of the plane.
 15. Thesystem of claim 1, wherein the waveguides are ridge waveguides that areeach defined by a ridge of a medium extending from a slab of the mediumsuch that each ridge extends from the same slab and such that the mediumextends continuously from the slab into each ridge.
 16. The system ofclaim 1, wherein the light transmitting medium extends continuously fromthe waveguides to the light sensors such that the light signals travelexclusively through the light transmitting medium when traveling fromthe waveguides to the light sensors.
 17. The system of claim 1, whereinthe light sensor array is immobilized relative to the optical component.18. The system of claim 1, wherein: the light barrier is between anelectrical contact pad on the optical component and an electricalcontact pad on the light sensor array; the electrical contact pad on theoptical component is positioned on a region of the optical componentthat is between ports and the electrical contact pad on the light sensorarray is positioned on a region of the light sensor array that isbetween light sensors; the light barrier is electrically conductive; thelight barrier is positioned so as to surround an optical path that thefirst light signal travels from the waveguide from which the first lightsignal exited to the associated light sensor; a bonding medium ispositioned adjacent to the light barrier, the bonding medium bonding theoptical component to the light sensor array and being different from athe light transmitting medium, the light transmitting medium beingpositioned between the optical component and the light sensor such thatthe light signals travel through the light transmitting medium whentraveling from the waveguides to the light sensors; the light sensorarray is positioned over the optical component such that the ports arebetween the substrate and the light sensor array; and the ports areconfigured to re-direct the light signals from the waveguides to aregion over the optical component such that the waveguides arepositioned between the substrate and the region over the opticalcomponent.
 19. The system of claim 1, further comprising a lighttransmitting medium being positioned between the optical component andthe light sensor such that the light signals travel through the lighttransmitting medium when traveling from the waveguides to the lightsensors.
 20. The system of claim 1, wherein the light signals that exitfrom the optical component through one of the ports each exit from oneof the waveguides before traveling through the one of the ports.
 21. Thesystem of claim 20, wherein the ports are each configured to change adirection that the light signals travel to a second direction that isdifferent from a first direction that each light signal travels uponexiting from one of the waveguides.
 22. The system of claim 21, whereinthe second direction is toward a location over the optical componentsuch that the waveguides are positioned between the substrate and thelocation over the optical component.
 23. The system of claim 1, whereinthe light sensor array is physcially attached to the optical componentsuch that the light sensor array is immobilized relative to the opticalcomponent.
 24. An optical system, comprising: an optical componenthaving a plurality of waveguides that each has a length, the waveguidepositioned on a substrate such that each waveguide is immobilizedrelative to the substrate along the length of the waveguide, the opticalcomponent also having ports through which light signals guided throughthe waveguides exit the optical component; a light sensor arrayincluding a plurality of light sensors, the array being coupled to theoptical component such that different light sensors receive lightsignals that exit the optical component through different ports; a lighttransmitting medium between the optical component and the light sensorarray, the light transmitting medium positioned such that the lightsignals travel through the light transmitting medium when traveling fromthe waveguides to the light sensors; and a light barrier between theoptical component and the light sensor array, the light barrier alsobeing positioned between different regions of the light transmittingmedium, and the light barrier also being positioned over a region of theoptical component that is located between adjacent ports.
 25. The systemof claim 24, wherein the light barrier is between an electrical contactpad positioned on the optical component and an electrical contact padpositioned on the light sensor array.
 26. The system of claim 24,wherein the light barrier is electrically conductive.
 27. The system ofclaim 24, wherein a bonding medium is positioned adjacent to the lightbarrier, the bonding medium bonding the optical component to the lightsensor array.
 28. The system of claim 24, wherein the light sensor arrayis positioned over the optical component such that the ports are betweenthe substrate and the light sensor array.
 29. The system of claim 24,wherein the ports are configured to re-direct the light signals from thewaveguides to a region over the optical component such that thewaveguides are positioned between the substrate and the region over theoptical component.
 30. The system of claim 24, wherein the light barrieris one of a plurality of light barriers between the optical componentand the light sensor array, more than one of the light barrierspositioned over a region of the optical component between adjacent portsand also positioned between different regions of the light transmittingmedium.
 31. The system of claim 24, wherein that the light signals thatexit from the optical component through one of the ports each exit fromone of the waveguides before traveling through one of the ports.
 32. Thesystem of claim 31, wherein the ports are each configured to change adirection that the light signals travel to a second direction that isdifferent from a first direction that each light signal travels uponexiting from one of the waveguides.
 33. The system of claim 24, whereinthe light sensor array is physcially attached to the optical componentsuch that the light sensor array is immobilized relative to the opticalcomponent.